Bernoulli chuck (contact type)
Bernoulli chuck compatible with warped wafers and thin wafers.
This is a Bernoulli chuck that accommodates warped and thin wafers, offering excellent cost performance. It can be mounted on any type of robot in our atmospheric environment transport robots. We conduct verification using sample wafers and design to accommodate various sizes, warpage amounts, and wafer thicknesses based on the customer's desired shape. The Bernoulli effect is used to suction the workpiece against the substrate. To prevent shifting during transport, it is held in place by the frictional force of friction rubber. The chuck side makes contact, but it can be used interchangeably for different wafer sizes (note that this may not be possible depending on the combination), allowing for a thinner chuck compared to non-contact types. Since the suction is based on Bernoulli's principle, it applies force over a wider area than vacuum suction chucks, making it effective for thin wafers.
- Company：ジェーイーエル
- Price：Other
